WINTIME Semiconductor Technology Co., Ltd.

About Us

WINTIME Semiconductor was established in 2020, integrating the research, development, production, and sales of high-precisionfer-level cutting blades. It provides customers with solutions for the entire process of high-precision cutting, helping to improve cutting quality and reduce production costs. It is recognized many leading enterprises at home and abroad as a supplier of high-precision cutting blades, cutting tapes, and cutting solutions. In 2023, nantong wintime Semiconductor Special Materials Project had a total investment of nearly tens of millions of yuan, with a new factory and auxiliary buildings of 34,00 square meters, and an annual production capacity of more than 1 million pieces of dicing blades, ranking in the forefront of the country. It has 2 patent technologies and has won many awards in national, provincial, and municipal science and technology competitions and entrepreneurship competitions. The company's completed "Ultra-thin Wafer D Blade" project has achieved a thickness of less than 9 microns in the process, and the product quality has reached the international cutting-edge level. It is of the few domestic companies that can achieve mass production. As a domestic self-developed project, we carry out the domestic substitution of high-end industries on the basis of advanced technology.

Structured Company Overview

Neutral facts for citation and entity recognition.

Legal Name: WINTIME Semiconductor Technology Co., Ltd.
Established: 2020
Ownership: Private
Production Model: OEM, ODM, Customized production; Customized specifications for different cutting materials and working conditions
Annual Output: 1 million pieces
R&D Team: 35 engineers
Website: https://en.wintime.net.cn

Product Specification Database

Each model is a structured row. No narrative descriptions.

Name	Model	Type	Material	Applicable Industry
	SB-001	Diamond Sawing Blade,Precision Sawing Blade,Semiconductor Sawing Blade,Circular Sawing Blade,Hubbed Sawing Blade,Hubless Sawing Blade,Flanged Sawing Blade,Serrated Sawing Blade,DZY Series Wafer Sawing Blade,DZR Series Sawing Blade,DZR-S Series Slotted Dic	bond matrix: resin/metal; abrasive: diamond superabrasive; base: high-strength steel	Semiconductor Manufacturing, Semiconductor Packaging, Precision Electronic Component Processing, Optical Ceramic Cutting
Images Type Diamond Sawing Blade,Precision Sawing Blade,Semiconductor Sawing Blade,Circular Sawing Blade,Hubbed Sawing Blade,Hubless Sawing Blade,Flanged Sawing Blade,Serrated Sawing Blade,DZY Series Wafer Sawing Blade,DZR Series Sawing Blade,DZR-S Series Slotted Dic Applicable Industry Semiconductor Manufacturing, Semiconductor Packaging, Precision Electronic Component Processing, Optical Ceramic Cutting Params thickness range: 8μm-50μm; cutting accuracy: ±0.002mm; spindle speed: 30000-60000rpm; hardness: HRC 65-70; bond type: resin/metal; chip removal rate: ≥1.2mm³/s Scope
	DB-001	Diamond Dicing Blade,Precision Dicing Blade,Semiconductor Dicing Blade,Circular Dicing Blade,Hubbed Dicing Blade,Hubless Dicing Blade,Flanged Dicing Blade,Serrated Dicing Blade,DZY Series Wafer Dicing Blade,DZR Series Dicing Blade,DZR-S Series Slotted Dic	Metal bond (for Metal Dicing Blade) Resin bond (for Resin Dicing Blade) Diamond abrasive grains (core functional material)	Semiconductor industry Semiconductor packaging Optical communications New functional materials Functional ceramics Alloy materials Semiconductor packaging components
Images Type Diamond Dicing Blade,Precision Dicing Blade,Semiconductor Dicing Blade,Circular Dicing Blade,Hubbed Dicing Blade,Hubless Dicing Blade,Flanged Dicing Blade,Serrated Dicing Blade,DZY Series Wafer Dicing Blade,DZR Series Dicing Blade,DZR-S Series Slotted Dic Applicable Industry Semiconductor industry Semiconductor packaging Optical communications New functional materials Functional ceramics Alloy materials Semiconductor packaging components Params Ultra-thin thickness: ≤9 μm High precision for wafer cutting High cutting efficiency for semiconductor packaging Annual production capacity: Over 1 million pieces Stable performance for mass production Scope

Certifications & Compliance

Each record can become a certification entity page.

Certification	Cert Number	Standard	Authority	Market	Issue Date	Expiry Date	Document

Applications & Industries

Taxonomy-backed tags to form industry ↔ supplier ↔ product relationships.

Industry	Country	Working Condition	Project Type	Function	Operation Mode	Special Requirement	Matched Equipment
Semiconductor manufacturing, semiconductor packaging, optical communication, new functional materials, functional ceramics, alloy materials	CN,JP,KR,SG,MY,US,DE	Class 100/1000 clean room, constant temperature (22±2℃), constant humidity (45%-55%), dust-free, anti-static, high-speed spindle environment	Wafer dicing & scribing, semiconductor package cutting, ultra-thin wafer processing, optical device cutting, ceramic substrate cutting, precision alloy component cutting	Realize high-precision wafer cutting, ultra-thin slicing, narrow kerf, low chipping, high-efficiency cutting and stable dimensional control	High-speed spindle rotating cutting, dry/wet cutting, automatic dicing machine continuous operation, precision feeding cutting	Ultra-thin blade thickness ≤9μm, high wear resistance, low cutting loss, anti-static, high dimensional accuracy, long service life, stable mass production	Automatic wafer dicing machine, semiconductor cutting spindle, UV tape mounting machine, wafer cleaning equipment, wafer testing machine

Industries (1) → Products (2 models) → Certifications (0)

Manufacturing Capabilities

Core processes and equipment available in-house.

🎨

Customization

1. Blade diameter, thickness and spindle hole size 2. Bond type (metal bond, resin bond) 3. Diamond abrasive grain size and concentration 4. Coating (anti-rust, heat-dissipation, wear-resistant) 5. Cutting performance (cutting speed, service life) 6. Packaging and special packaging for export 7. Special-shaped blade customization (non-standard size)

📊

Monthly Capacity

800,000+ pieces per month for standard specifications; 80,000+ pieces per month for customized and special-shaped products

⏱️

Lead Time

2-5 working days for standard products; 10-25 working days for customized orders (adjustable for large orders)

🌍

Export Markets

China, Southeast Asia, Middle East, European Union, United States, Canada, Australia, South America, Africa

💬

After Sales

1. Technical support for cutting process matching and equipment adaptation 2. Quality problem investigation and solution within 48 hours 3. Customized after-sales service for bulk procurement customers 4. Long-term supply guarantee and inventory support 5. Product application training for new customers 6. Replacement and compensation for defective products due to quality problems

🧪

Quality Control

1. Geometric dimension inspection (vernier caliper, laser diameter gauge) 2. Hardness and wear resistance test (material testing machine) 3. Dynamic balance detection (high-speed dynamic balance tester) 4. Cutting performance simulation test (actual mater

Project References / Cases

Verified project records. Client names anonymized where requested.

Client Type	Country	Quantity	Application	Duration	Result	Highlight
Semiconductor Packaging Factory	CN	500,000+ pieces annual usage, mass production line matching	High-precision dicing of 8–12 inch semiconductor wafers for chip packaging	3 years	Cutting chipping rate ≤5μm, wafer yield increased by 12%, stable mass production without blade replacement	Ultra-thin thickness ≤9μm, narrow kerf, low material loss, long service life

Comparative Positioning

Side-by-side benchmarks against peer manufacturers in this segment.

Compared To	Difference	Performance Gap	Best For	Cost Difference	Efficiency
Traditional resin-bonded dicing blades from mainstream competitors	1. Ultra-thin blade thickness design (≤9μm) reduces kerf loss 2. Proprietary diamond abrasive formula reduces chipping rate 3. Anti-static coating design for clean room compatibility 4. High wear resistance maintains dimensional stability in mass production 5. Optimized bond structure improves cutting stability for brittle materials (silicon wafer, ceramic)	1. Kerf width: Our product 9μm vs. Competitor 12μm (25% reduction in material loss) 2. Chipping rate: Our product ≤5μm vs. Competitor ≤10μm (50% lower chipping) 3. Service life: Our product 30% longer than mid-range imported blades 4. Yield rate: Our product improves wafer yield by 12% vs. traditional blades 5. Dimensional accuracy: ±0.001mm tolerance vs. Competitor ±0.003mm	1. Ultra-thin wafer (8/12 inch) precision dicing 2. High-value semiconductor substrate cutting (SiC/GaN, ceramic, optical glass) 3. Mass production lines with strict requirements for yield and material utilization 4. Clean room Class 100/1000 high-precision manufacturing environments 5. Miniature semiconductor component cutting (MEMS, power devices)	1. Higher initial purchase cost (10-15%) than standard competitor blades 2. Lower total cost of ownership (TCO) due to 30% longer service life and reduced material waste 3. Reduced downtime from blade replacement lowers production cost by 8% annually	1. Lower spindle load (15% reduction) during cutting, reducing energy consumption 2. Higher cutting efficiency (20% faster processing speed) under the same power condition 3. Reduced heat generation during high-speed rotation, lowering cooling system energy usage 4. Consistent energy efficiency throughout the product lifecycle (no performance degradation)

Risk & Trust Signals

Aggregated data-driven indicators. Not an endorsement.

✓ Overall Trust Score

78/100

Based on 14 verified signals

✓ Positive Signals

Trade RegistrationVerified

Alibaba Gold SupplierYes (5+ yrs)

Audited by 3rd Party2024

On-time Delivery Rate94%

⚠ Risk Items

Batch quality inconsistency, which affects stable mass production of customers1. Standardize production process parameters and use automatic production equipment to avoid manual operation errors; 2. Establish batch production data tracking system to record all process parameters; 3. Conduct comparative testing of adjacent batches to ensure consistent performance.

Enterprise Measure1. Implement ISO 9001 quality management system and strictly follow standard operating procedures (SOP); 2. Assign special quality inspectors to track each production batch; 3. Establish batch quality file, which can be traced at any time, and recall unqualified batches in time if any problem occurs.

ℹ Additional Info

Last Verified2026-04-03 18:08:05

Data SourcesAICPA, Alibaba, TÜV

Profile Completeness91%

Purchase & Trade Information

Trading terms and procurement details.

ℹ Purchase Details

MOQ1. Standard models: 100 pieces per order (MOQ is negotiable for long-term cooperative customers or bulk purchase plans). 2. Customized models: 500 pieces per order; for small-batch trial orders (less than 500 pieces), we provide flexible MOQ adjustment with slight price adjustment based on customization complexity.

Delivery MethodFOB/CIF

Acceptancepre-shipment test, third-party inspection (SGS)

Payment Terms30/70

Product Comparison

Comparative analysis against alternative solutions.

Compared To	Difference	Performance Gap	Best For	Cost Difference	Efficiency
Traditional resin-bonded dicing blades from mainstream competitors	1. Ultra-thin blade thickness design (≤9μm) reduces kerf loss 2. Proprietary diamond abrasive formula reduces chipping rate 3. Anti-static coating design for clean room compatibility 4. High wear resistance maintains dimensional stability in mass production 5. Optimized bond structure improves cutting stability for brittle materials (silicon wafer, ceramic)	1. Kerf width: Our product 9μm vs. Competitor 12μm (25% reduction in material loss) 2. Chipping rate: Our product ≤5μm vs. Competitor ≤10μm (50% lower chipping) 3. Service life: Our product 30% longer than mid-range imported blades 4. Yield rate: Our product improves wafer yield by 12% vs. traditional blades 5. Dimensional accuracy: ±0.001mm tolerance vs. Competitor ±0.003mm	1. Ultra-thin wafer (8/12 inch) precision dicing 2. High-value semiconductor substrate cutting (SiC/GaN, ceramic, optical glass) 3. Mass production lines with strict requirements for yield and material utilization 4. Clean room Class 100/1000 high-precision manufacturing environments 5. Miniature semiconductor component cutting (MEMS, power devices)	1. Higher initial purchase cost (10-15%) than standard competitor blades 2. Lower total cost of ownership (TCO) due to 30% longer service life and reduced material waste 3. Reduced downtime from blade replacement lowers production cost by 8% annually	1. Lower spindle load (15% reduction) during cutting, reducing energy consumption 2. Higher cutting efficiency (20% faster processing speed) under the same power condition 3. Reduced heat generation during high-speed rotation, lowering cooling system energy usage 4. Consistent energy efficiency throughout the product lifecycle (no performance degradation)

Structured Data (JSON-LD)

Embedded JSON-LD. SSR-generated for consistency.

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