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The DZR-S Series features a slotted design that enhances cooling and chip removal during high-speed dicing. With thickness options from 8μm to 50μm and cutting accuracy of ±0.002mm, this blade is optimized for slicing semiconductor wafers and ceramics where debris management is critical.
| Parameter | Value |
|---|---|
| Thickness Range | 8μm - 50μm |
| Cutting Accuracy | ±0.002mm |
| Spindle Speed | 30000 - 60000 rpm |
| Hardness | HRC 65-70 |
| Bond Type | Resin / Metal |
| Chip Removal Rate | ≥1.2 mm³/s |
| Abrasive | Diamond Superabrasive |
| Base Material | High-Strength Steel |
Available in diameters 58-102mm with various slot counts and geometries. Custom slot patterns can be designed for specific applications.
The DZR-S blade uses a high-strength steel core with electroplated or sintered diamond rim. Slots are strategically positioned to balance strength and cooling.
Custom slot design, thickness, and bond type available. MOQ for standard: 100 pcs; customized: 500 pcs. Trial orders accepted.
Slots are designed to maintain structural integrity while enhancing cooling. Finite element analysis ensures no reduction in performance.
Yes, dressing is possible using standard aluminum oxide dressing sticks.
For sapphire, use lower feed rates (0.5-1 mm/s) and higher spindle speed (50000 rpm) with resin bond.
Sample orders are available for evaluation before volume purchase.
Blades are packed in individual plastic cases, then in foam-lined cartons.
Contact us for quote and lead time:
Email: shenxiangfei@ntwintime.com
Tel: +86 13851530812
Whatsapp: +8618888053207
