JS Series Metal Bond Diamond Dicing Blade

Product Summary

The JS Series features a robust metal bond matrix designed for extended blade life when cutting hard and abrasive materials such as sapphire, ceramics, and metal composites. Maintains ±0.002mm accuracy over thousands of cuts. Thickness from 8μm to 50μm.

Key Selling Points

• Extended Blade Life: Metal bond holds diamond grains longer, reducing blade change frequency.
• Hard Material Cutting: Ideal for sapphire, alumina, and dense ceramics.
• Consistent Accuracy: ±0.002mm tolerance ensures uniform die size across long production runs.
• High Feed Rates: Capable of higher feed speeds compared to resin bond for certain materials.

Technical Specifications

Models and Options

Available in diameters 58-102mm with metal bond hardness variations. Custom hub designs (hubbed or flanged) upon request.

Materials and Structure

Metal bond (typically cobalt or iron-based) with diamond grains. The bond is sintered at high temperature for maximum durability.

Applications

• Sapphire wafer dicing
• Alumina ceramic cutting
• Metal matrix composite slicing
• Optical glass precision cutting

Customization

Custom bond composition, thickness, and diameter available. MOQ for standard: 100 pcs; custom: 500 pcs.

FAQ

1. How does metal bond compare to resin bond in kerf width?

Metal bond blades typically have slightly larger kerf but provide longer life.

2. Can these blades be used for dicing copper?

Yes, metal bond is preferred for ductile metals like copper and aluminum.

3. What is the maximum cutting depth?

Maximum cut depth depends on blade exposure; typical exposure up to 1.5mm.

4. Do you offer reconditioning services?

Yes, we can recondition used metal bond blades to restore sharpness.

5. What are the shipping terms?

We ship via FOB/CIF. Lead time: 10-15 working days for standard orders.

Inquiry Information

Get in touch for a quote:
Email: shenxiangfei@ntwintime.com
Tel: +86 13851530812
Whatsapp: +8618888053207