JS Series Metal Bond Dicing Blade

Product Summary

The JS series metal bond dicing blade is designed for high-precision cutting of hard and brittle materials such as functional ceramics, alloy materials, and semiconductor components. Its metal bond matrix provides excellent wear resistance and dimensional stability, ensuring consistent cutting performance over extended periods.

Key Selling Points

• Metal Bond Matrix: Offers superior wear resistance and long blade life, reducing replacement frequency.
• Diamond Abrasive Grains: Ensures high cutting efficiency and precision even for hard materials like ceramics and alloys.
• Stable Dimensional Control: Maintains kerf width and depth consistency across hundreds of cuts.
• Versatile Application: Suitable for semiconductor packaging, functional ceramics, alloy materials, and optical communications.
• Annual Capacity Over 1M Pieces: Reliable supply for high-volume users.

Technical Specifications

Models and Options

JS series offers both standard and customized models. Standard models MOQ 100 pieces; customized MOQ 500 pieces. Trial orders available.

Materials and Structure

Composed of a metal bond matrix with embedded diamond abrasive grains. The metal bond provides strong grain retention and thermal stability, ideal for high-speed cutting.

Applications

• Semiconductor component dicing
• Functional ceramics cutting (alumina, zirconia, etc.)
• Alloy materials precision slicing
• Optical communication device dicing
• New functional material processing

Customization

Blade thickness, diameter, and bond hardness can be customized. Contact our engineering team for specific requirements.

FAQ

Inquiry Information

Contact us for pricing and technical support:
Email: shenxiangfei@ntwintime.com
Tel: +86 13851530812
WhatsApp: +8618888053207

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