Kiss Cutting Machine

Product Specification

Feature

1. The machine is applicable to semi-broken cutting of double-layer nonmetal material by laser wood die cutter. That is, the upper layer materials are completely cut without cutting the lower layer materials. It is used for products of electronics and adhesive sticker industries. 2. The whole machine adopts PLC control. Through driving the feeding board by the frequency conversion motor, the materials are input from one side of machine, and after die cutting, they will return automatically. 3. The main machine adopts four-column guiding, double-crank balancing and four-column blocking fine-adjustment mechanism, which can guarantee the accuracy of die cutting of machine. All movable connecting parts are equipped with central oil supply automatic lubricating device, which reduces the abrasion to the minimum extent. 4. The inlet and outlet of cutting area of the machine are installed with safety screens, which can guarantee personal safety of operators. 5. Products of special specifications can be made to order.