Rigid-Flex PCB – Rigid & Flexible Combo | PCBMASTER Rigid-Flex PCB – Rigid & Flexible Combination, ±6% Impedance, Multilayer Product Summary PCBMASTER rigid-flex PCBs integrate rigid FR-4 sections with flexible polyimide layers, enabling 3D circuit interconnection. Supports up to 64 layers, ±6% single-ended impedance, and special processes like back-drilling, via filling, and N+N stack-ups. Ideal for applications requiring reliability and space savings, such as automotive, medical, and aerospace.
Key Selling Points Hybrid Construction: Combines FR-4 rigidity with polyimide flexibility for 3D designs (source fact: materials include FR-4 and polyimide).High Layer Count: Up to 64 layers, capable of complex rigid-flex stack-ups (source fact: layer count ≤64 layers).Advanced Processes: Back-drill (min stub 5mil), via filling (max dimple <10μm), any-layer HDI possible (source fact: back-drill parameters, plated filled hole dimple).Reliability: UL 94V-0, RoHS compliant, 99.6% first-pass yield (source fact: case study yield).Technical Specifications Parameter Value Layer Count Up to 64 layers Rigid Material FR-4 TG155/TG180 Flex Material Polyimide (PI) Impedance Tolerance Single-ended ±6%, Differential ±7% Min Back-Drill Stub 5 mil Plated Filled Hole Dimple ≤10 μm Min Laser Blind Via 65/165 μm
Models and Options Custom configurations: number of flex layers, rigid sections, coverlay thickness, stiffeners. Available with or without EMI shielding.
Materials and Structure Rigid: FR-4 TG155/180. Flex: Polyimide. Optional adhesiveless bonding for dynamic flex. Supports N+N any-layer HDI in rigid sections.
Applications Automotive: Camera modules, battery management systems. Medical: Implantable devices, diagnostic probes. Consumer Electronics: Foldable phones, wearables. Aerospace: Avionics, satellites.
Customization Custom impedance, bend radius, connector location. No MOQ – prototypes from 1 piece.
FAQ 1. What is the minimum bend radius for your rigid-flex? Typical 6:1 dynamic, 3:1 static (relative to flex thickness).
2. Can you combine HDI in rigid sections? Yes, we support any-layer HDI in rigid-flex designs.
3. How do you ensure reliability at the rigid-flex interface? We use controlled impedance and strain relief designs, tested via thermal cycling.
4. What certifications do you hold? ISO 9001, IATF 16949, UL, RoHS.
5. Can you provide a DFM review for rigid-flex? Yes, we offer free DFM audit before production.
Inquiry Information Email: service@pcbmaster.com | Tel: +86 190-6639-6428
Image Filename and Alt Suggestions Main image: rigid-flex-pcb-assembly.jpg (Alt: Rigid-flex PCB assembly front view).
