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SZ Series Resin Bond Dicing Blade for Low-Stress Wafer Slicing

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SKU: 9806757319
модель: DB-001

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SZ Series Resin Bond Dicing Blade

Product Summary

The SZ series resin bond dicing blade is designed for low-stress, high-precision cutting of fragile materials such as semiconductor wafers, optical glass, and functional ceramics. The resin bond offers a softer cutting action, reducing chipping and subsurface damage, ideal for thin and delicate substrates.

Key Selling Points

  • Resin Bond Matrix: Provides a flexible, shock-absorbing cut that minimizes chipping and cracks on fragile materials.
  • Diamond Abrasive Grains: Delivers precise cutting edges with consistent quality.
  • Low Cutting Stress: Reduces mechanical stress on the workpiece, improving yield for thin wafers.
  • High Cutting Efficiency: Optimized for dry and wet cutting processes in automatic dicing machines.
  • Annual Capacity Over 1M Pieces: Ensures supply continuity for large-scale production.

Technical Specifications

ParameterValue
Bond TypeResin bond
Abrasive MaterialDiamond
Thickness RangeCustomizable (typically 20-50μm)
Cutting ModeDry/Wet
Annual Production CapacityOver 1 million pieces

Models and Options

Standard and customized models available. MOQ: 100 pieces (standard), 500 pieces (customized). Trial orders negotiable.

Materials and Structure

The resin bond matrix holds diamond grains in a resilient polymer, providing excellent surface finish and reduced cutting forces. Suitable for applications where damage to the workpiece must be minimized.

Applications

  • Semiconductor wafer dicing (thin wafers)
  • Optical communication device cutting
  • Functional ceramics components
  • New functional material slicing
  • Glass and quartz dicing

Customization

We can adjust bond hardness, grain size, and blade dimensions to match specific materials and cutting speeds. Contact our technical team.

FAQ

Q1: What is the advantage of resin bond over metal bond?
A: Resin bond provides a softer cut, reducing chipping and stress on fragile materials, ideal for thin wafers and optical components.

Q2: Can the SZ blade be used for ultra-thin wafer cutting?
A: Yes, it is designed to minimize stress and damage, suitable for ultra-thin wafers.

Q3: What is the MOQ for standard SZ models?
A: 100 pieces for standard models; 500 for customized.

Q4: Is testing provided before shipment?
A: Yes, pre-shipment testing and third-party inspection are available.

Q5: What payment terms do you accept?
A: 30/70 terms (30% deposit, 70% before shipment).

Q6: Can I get a free sample?
A: Small-batch trial orders are available with flexible pricing. Please contact us.

Q7: How long does delivery take?
A: Lead time depends on order quantity and customization. Standard orders typically ship within 2-4 weeks.

Inquiry Information

Email: shenxiangfei@ntwintime.com
Tel: +86 13851530812
WhatsApp: +8618888053207

Image

SZ Series Resin dicing blade top view